Temescal Control System
The Temescal Control System (TCS) provides fully intergrated, recipe-driven process and vacuum control. Operating in any of three password-protected modes, the TCS also offers process variable monitoring, process and historical trend tracking, and process data logging.

TCS System Map During Deposition
The TCS Automatic Mode
Auto Mode operation provides fully automated execution of user-programmed recipes consisting of up to twenty process steps, as well as full abort diagnostics. The TCS Auto Mode also offers independent autopump and autovent operations, automated cryopump regeneration, and automated rate-of-rise testing.
Manual Mode Operation
The TCS Manual Mode enables the user to set process parameters, operate major components and subsystems individually with full interlock protection, and execute nonautomated single-film deposition processes.
Service Mode Operation
The TCS Service Mode provides noninterlocked low-level control over any of the system’s valves, pumps, motors, or power supplies.
Options
System Control
- SECS/GEM interface to TCS
- Chamber temperature monitoring
- TCS-controlled auto-blowdown for turret source
- TCS simulator for off-line training and process development
- A second XTC/3 deposition controller to support codeposition
Electron Beam Source, Power Supply and Sweep
- Upgrade to Temescal’s PopTop gun
- Up to three resistance sources
- 4-in. source well extension collar
- One additional fixed e-beam source
- One wire feeder per e-beam source on dual-source systems
- Dual wire feeders on single-source systems
- Power supply upgrade to 15-kW Temescal Simba2
- A second SS64 programmable beam sweep controller
Vacuum Pumping and Control
- Soft roughing and venting under TCS control
- Upgrade to a higher-capacity mechanical pump
Product Chamber
- Substrate heaters
- One 5-cm ion source
- A residual gas analyzer
- A second CT-400 product chamber cryopump
- Cryopump throttling
- Product chamber hot water circulation
- Process gas control for up to three gases
Process
- Additional uniformity (shadow) masks
- Process development and film characterization